Archive | Press Releases

ASUS Readies Server and Workstation Platforms; Refreshed Systems will Support New Intel® Xeon® 5600, Xeon® W 3680

Posted on 18 March 2010 by bluetooth

ASUS Readies Server and Workstation Platforms
for Next-generation 32nm, 6-core Performance
Refreshed Systems will Support New Intel® Xeon® 5600, Xeon® W 3680
and Core™ i7 Processors
 
ASUS today announced that it is ready to support upcoming 32nm, 6-core processor platforms in its refreshed server and workstation lines. ASUS server motherboards and systems will support Intel® Xeon® 5600 processors, while its workstation motherboards will be ready for Intel® Core™ i7 980X and Xeon® W3680 processors.
 
Better Performance, Enhanced Efficiency, and Improved Security
The Intel® Xeon® 5600 Series enterprise-class processors—based on the new 32nm infrastructure—delivers 50% more cores and cache, as well as 60% more performance than its 45nm predecessor. It also consumes 30% less power than previous generation processors. With support for various security features such as Advanced Encryption Standard New Instructions (AES-NI), the Xeon® 5600 Series accelerates data encryption and guards against malicious software attacks—thereby greatly enhancing security during operations.
 
ASUS Server Motherboards and Server Systems with Intel® Xeon® 5600 Series Support
Server MotherboardsServer Systems
Z8PH-D12 SE/QDRRS700D-E6/PS8
Z8PE-D18RS704D-E6/PS8
Z8PE-D12XRS702D-E6/PS8
Z8PE-D12RS700-E6/RS4
Z8PH-D12/IFBRS500-E6/PS4
Z8NR-D12RS520-E6/RS8
Z8NH-D12TS700-E6/RS8
Z8NA-D6TS500-E6/PS4
Z8NA-D6C

 
Faster Graphics and Realistic 3D Rendering
The new Intel® Core™ i7-980X and Xeon® W3680 processors have six cores and 12 threads, delivering brilliant visual output that is vital for fast-paced and immersive personal computing and gaming. Equipped with Intel® Turbo Boost Technology, the processor also intelligently scales up performance and power as needed during intensive processing. ASUS’ workstation motherboards support all 32nm processors including the Intel® Core™ i7-980X, Xeon® W3680, and Xeon® 5600 Series.
 
ASUS Workstation Motherboards with Intel® Core™ i7-980X and Xeon® W3680 Support
Workstation Motherboards
P6T WS PRO
P6T6 WS REVOLUTION
P6T7 WS SUPERCOMPUTER

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ASUS introduces P7F7-E WS SuperComputer Mainboard

Posted on 17 March 2010 by bluetooth

ASUS Introduces Next-generation Serverboard Connectivity Features
P7F7-E WS SuperComputer Motherboard Leverages the Latest I/O Innovations for the Fastest and Most Comprehensive Data Transfers
 
ASUS today announced the launch of the new ASUS P7F7-E WS SuperComputer motherboard which maximizes transmission speeds by integrating the industry’s latest I/O technologies such as USB 3.0, SATA 6G storage interface, and IEEE 1394b FireWire standard. Additionally, the ASUS P7F7-E WS SuperComputer is equipped with the LGA1156 socket and the latest Intel® 3450 chipset with onboard graphics. For extreme gaming enjoyment, up to four ATI® CrossFireX cards or 3-way/2-way NVIDIA® SLI cards can be accommodated to generate smoother and sharper visuals. It also leverages NVIDIA® CUDA™ parallel computing architecture to support up to four NVIDIA® Tesla cards with Clarkdale Processors for intensive high-performance computing.
 

 
Ultra-fast Throughput with USB 3.0, SATA 6Gb/s and IEEE 1394b Interfaces
The ASUS P7F7-E WS SuperComputer is the best choice for providing comprehensive I/O support. It includes USB 3.0 ports—the latest connectivity standard with 4.8Gb/s speeds—to support next-generation components and peripherals. USB 3.0 transfers data ten times faster and is backward compatible with USB 2.0 components. Additionally, the ASUS P7F7-E WS SuperComputer includes Serial ATA (SATA) 6Gb/s storage interfaces for 6.0Gbps data throughput, thus enhancing scalability, accelerating data retrieval, and doubling the bandwidth of current bus systems. To support FireWire-enabled digital video recorders and computers, the ASUS P7F7-E WS SuperComputer also includes two IEEE 1394b ports supporting up to 800Mb/s speeds—doubling the previous IEEE 1394a speeds.
 
Massive Computing Power up to 4 Teraflops with CUDA Parallel Processing
A powerful and efficient platform, the ASUS P7F7-E WS SuperComputer supports high-performance computing for life sciences research, engineering and financial modeling with its NVIDIA ® CUDA™ parallel computing architecture. By accommodating up to four NVIDIA® Tesla cards with built-in Clarkdale processors, the ASUS P7F7-E WS SuperComputer generates up to 4 Teraflops of processing power from a total of 960 CUDA parallel processing cores.
 
Stunning Graphics with Multi-GPUs Powered by SLI or CrossFireX™ Technology
The ASUS P7F7-E WS SuperComputer provides incredible graphics flexibility and enhanced scalability from a single motherboard by supporting either 3-way/2-way SLI or 4-way CrossFireX technology. Users can install up to three SLI-capable GeForce® graphics cards at x16, x8, and x8 connection speeds, or two graphics cards at true x16 connection speeds.
 
Six Embedded Memory Slots for Flexible Memory Options
Embedded with six memory slots, the ASUS P7F7-E WS SuperComputer can accommodate up to 16GB of DDR3 memory. The flexible options include installing four 4GB modules or two 4GB modules and two 2GB modules. As the price of a 2GB module is 15% less than a 4GB module, the ASUS P7F7-E WS SuperComputer gives users the flexibility to acquire the most RAM at the lowest cost.
 
GPU Boost Delivers Free iGPU Upgrade
GPU Boost overclocks the integrated GPU in real time for the best graphics performance. The user-friendly UI supports direct frequency and voltage adjustments. Its ability to deliver multiple overclocking profiles also provides rapid and stable system-level upgrades within the OS environment.
 
Easy Connection of USB-based Devices with Quick Gate
Users can directly connect USB-based devices via the on-board Quick Gate interface—without an extension cable. This reinforces the connection link and prevents partial transmissions and loss of data.

 
Specifications
ModelP7F7-E WS SuperComputer
CPU Socket1x LGA1156 socket for Intel® Xeon™ 3400 series, Core™ i7/Core™ i5/ Core™ i3/Pentium®
Supports Intel® Turbo Boost Technology
ChipsetIntel® Ibex Peak 3450 Chipset/ Nvidia NF200*1
Memory6 DIMMs, supporting up to 16GB DDR3 2000(O.C.)*/1600/1333MHz.ECC, un-buffered memory
Power Phase16 + 3
Expansion Slots2x PCIe 2.0 x16 (@ x16 or x8)
2x PCIe 2.0 x16 (@ x8)
3x PCIe x1 (@ x1)
Multi-GPUSupports 3-way/2-way NVIDIA® Geforce SLI™ technology
Supports ATI® CrossFireX™ technology, up to Quad CrossFireX™
CUDA SupportSupport up to 4 NVIDIA GPUs
3x NVIDIA Tesla cards + 1x NVIDIA Quadro fX5800 card up to 960 cores
Each core delivers one teraflop of processing power
Storage2x SATA 6Gb/s, 6x SATA 3Gb/s
Gigabit LAN2
Audio10-channel output, DTS encoding
Other I/O ports1*PS/2, 1*IEEE1394a, 2*LAN, 6*USB(4 for USB2.0 and 2 for USB3.0, 1*Optical S/PDIF out, 1*DVI-I output pot
USB  2 USB 3.0 ports ( 2 ports at back panel)
12 USB 2.0 ports ( 6 ports at back panel, 6 ports at mid-board)
1394a 2 1394b ports (2 at back panel) + 1 1394a port (1 at back panel)
Form FactorATX Form Factor, 12 inches x 9.6 inches ( 30.5cm x 24.5cm )

Specifications are subject to change without prior notice. Please visit www.asus.com for more details.

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GIGABYTE GA-P55A-UD4P was used by Intel and Kingston® Technology Company, Inc., to certify the world’s fastest memory, Kingston’s HyperX® dual-channel DDR3 memory kit (Kingston® part#: KHX2400C9D3T1K2/4GX) running at 2400MHz

Posted on 16 March 2010 by bluetooth

– GIGABYTE GA-P55A-UD4P USB 3.0 Motherboard Validates World’s Fastest Memory –

– Intel Certifies Kingston HyperX Memory Clocked at Blazing 2400Mhz –

TAIPEI, Taiwan – March 16, 2010 – GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions today proudly announced that the GIGABYTE GA-P55A-UD4P was used by Intel and Kingston® Technology Company, Inc., to certify the world’s fastest memory, Kingston’s HyperX® dual-channel DDR3 memory kit (Kingston® part#: KHX2400C9D3T1K2/4GX) running at 2400MHz.

“GIGABYTE’s outstanding memory design on the P55 platform has already enabled many of the world’s top overclockers to break several standout overclocking records,” commented Tim Handley,Deputy Director of Motherboard Marketing at GIGABYTE Technology Co. Ltd. “We expect many more overclocking records to fall to the formidable combination of the world’s fastest Intel certified Kingston HyperX memory paired with a GIGABYTE P55 motherboard.”

“It is a tremendous achievement to create the Kingston 2400MHz DDR HyperX memory and receive Intel XMP validation as the fastest memory in the world,” said Mark Tekunoff, senior technology manager, Kingston. “We were able to reach this milestone using GIGABYTE’s GA-P55A-UD4P top-notch gaming motherboard. Together, with terrific partners like GIGABYTE, Kingston continues to push the frequency envelope when it comes to gaming and enthusiast memory.”

Intel’s certification is posted at: http://www.intel.com/en_US/Assets/PDF/prodspec/ww09-2010-XMP-self-cert_Core-i7-BlueBadge.pdf

To learn more about the extreme overclocking ability of GIGABYTE P55 motherboards, please visit:

http://www.gigabyte.com.tw/FileList/WebPage/mb_090908_p55_record/tech_090908_p55_record.htm

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MSI Wind U160 Atom N450 netbook won Germany’s prestigious iF design awards

Posted on 15 March 2010 by bluetooth

MSIs Wind U160 The Product of Outstanding Workmanship

A High-fashion Masterpiece

MSIs fashionable Wind U160 laptop, which won an award at Germanys prestigious iF design awards, is a slim, lightweight notebook PC with attractive exterior design that uses Intels Pine Trail processor platform, and provides battery run-time of up to 15 hours. This is a real masterpiece of modern fashion and high technology! Taipei The Wind U160, MSIs exquisitely designed small notebook PC, which has already won an Germanys iF product design awards and become a major talking point in the IT industry, has been formally launched onto the market! The Wind U160 is less than one inch thick, and weighs just 1 kg. It uses Intels Pine Trail platform, with the highly-integrated N450 Atom processor. The laptop casing features MSIs unique color-film-print (CFP) technology with a two-color Fancy Gold and Jet Black color scheme. With its attractive external appearance, slim, lightweight design and painstaking attention to detail, the U160 is sure to appeal to any fashion-conscious consumer.

MSI Notebook Marketing Director Sam Chern explains that the Wind U160 is a hi-tech, high-fashion product of MSIs outstanding craftsmanship. The Wind U160s energy-saving 10-inch LED display boasts a reaction time of just 8 millisecond, twice as fast as any other comparable product. The U160 also incorporates MSIs unique Chiclet keyboard, a seamless touchpad and other innovative design features. Besides being attractive to look at and convenient to use, the Wind U160 has a battery run-time in excess of 15 hours, enabling users to keep working all day without having to worry that they may run out of power. 

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An iF design award adds extra luster to this luxury hi-tech device

An innovative design and outstanding tactile appeal: The Wind U160 has an ultra-slim, lightweight body, with a rod-type screen hinge exclusive to MSI. The power switch features an embedded blue LED light, while the chassis exterior has MSIs brand-new color-film-print surface treatment, with an attractive Fancy Gold and XXX Black color scheme; when the laptop is switched on, the MSI brand logo shines out in lustrous silver-white. The section of the chassis on which the users hands rest is also coated with scratch-resistant, hard-wearing color-film-print. This attention to detail gives the Wind U160 immense visual and tactile appeal; every aspect of the laptop radiates class and elegance.

iF product design award: With its revolutionary exterior design, which incorporates many new, high-fashion elements, the MSI Wind U160 has attracted a great deal of positive comment, and has been the recipient of a product design award at the 2010 iF design awards in Germany. All of this has made the Wind U160 one of the most sought-after hi-tech luxury mobile computing devices. The U160 uses the latest rod-type screen hinge design, with the power switch located on the end of the hinge. It also features a seamless touch-pad that is exclusive to MSI, and a unique, beautiful Chiclet keyboard. The combination of the bright, shiny color-film-print coating in the keyboard area with the sparkling silvery touch pad key creates an all-over luxury feel that makes it difficult for people to keep their eyes off it.

MSIs attention to detail makes the Wind U160 very user-friendly

A wide, seamless touch-pad: The Wind U160 uses a seamless touch-pad design that is exclusive to MSI. By widening the touch-pad, MSI has given the keyboard area a more streamlined look, while also ensuring smooth touch-pads cursor operation. All of this combines to make life more enjoyable for Wind U160 users.

A brand-new design, with the unique Chiclet keyboard: The U160 uses a Chiclet keyboard, exclusive to MSI, where each key is situated independently; this makes for greater stability, and also makes the keyboard quieter to use. Every time your fingers touch the keys, you experience MSIs commitment to providing a perfect user experience; this commitment to user comfort underpins all of MSIs R&D and manufacturing operations.

A 10-inch LED screen with a reaction time of just 8 millisecond: The Wind U160 has an energy-saving 10.1-inch screen with LED backlight. The displays reaction time of just 8 seconds makes it twice as fast as a traditional notebook PC, and provides ultra-smooth performance when watching a film or animation. With highly detailed image quality and bright colors, the Wind U160 demonstrates that a small notebook PC can provide movie theater quality audiovisual enjoyment.

Ultra-long 15-hour battery run-time*

Intels latest N450 Atom processor: The Wind U160 uses the Intel Pine Trail platform, with the new-generation, single-chip architecture Intel Atom N450 processor. With very low power consumption of just 5.5 watts, this processor supports extra-long battery run-time, while also providing outstanding display performance.

MSIs unique ECO technology: The Wind U160 features MSI-developed ECO energy-saving technology. Just by pressing a button, the user can switch between five different power usage modes: gaming, film viewing, presentation, word processing, and Turbo Battery. This feature helps to increase battery run-time. Testing has shown that the MSI Wind U160 can achieve battery run-time of up to 15 hours, enabling users to keep working all day without needing to worry about the battery running down.

Support for 3.5G mobile communications: Besides providing ultra-long battery run-time of 15 hours, the Wind U160 also offers comprehensive wireless networking functionality. The U160 has built-in 802.11 b/g/n capability, Bluetooth V2.0 EDR, and supports 3.5G (Enhanced Third Generation) mobile communications. With the Wind U160, you can enjoy convenient, high-speed wireless Internet communications at any time and from any location, overcoming the barriers of distance. The U160 allows you to experience the future of high-end mobile computing!

*Actual battery run-time will vary depending on usage conditions; built-in 3.5G capability may not be available in all markets.

About MSI NOTEBOOK

MSI Notebook’s goal is to become the most trusted name in laptop computers. We stand by our principles of breakthroughs in design, the pursuit of excellence, and technological innovation as we have continued to raise the bar for ourselves and have accomplished a great deal of pioneering work in the industry. If you need more product information, please visit http://www.msi.com

U160 Spec

OS Microsoft ® Windows® 7 Starter
CPU Intel® Atom™ Processor  N450 (1.66GHZ)
Chipset Intel® NM10 Express Chipset
Graphic Intel® Graphics Media Accelerator 3150
Memory DDR2 667 support up to 2 GB(1 DIMM slot)
LCD 10.1” (1024 x 600) WSVGA LED
HDD 160 GB or above (2.5” SATA)
Card reader 2 in 1 (support SD,MMC)
I/O D-sub*1 , USB 2.0*3 , Mic-in Headphone, RJ45
Battery 3 cells  / 6 cells ( optional)
Wireless 802.11 b/g/n, Bluetooth V2.0EDR
Webcam 1.3 M Webcam
Sound HD Audio, Stereo speakers
Dimension 265 x 165 x 24-25.4mm
Weight 1 Kg (with 3 cell battery)
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ASRock officially announces 890GX Extreme3 with UCC to unlock CPU core for AMD Phenom II 550BE, X3 710 processors

Posted on 13 March 2010 by bluetooth

890GX Extreme3

  1. Six-Core CPU Ready
  2. ASRock DuraCap (2.5 x longer life time), 100% Japan-made high-quality Conductive Polymer Capacitors
  3. Advanced V8 + 2 Power Phase Design, supports CPU up to 140W
  4. Supports UCC feature (Unlock CPU Core)
  5. Supports Dual Channel DDR3 1800(OC)
  6. Supports ATI™ Quad CrossFireX™, 3-Way CrossFireX™, CrossFireX™ and Hybrid CrossFireX™
  7. Integrated AMD Radeon HD 4290 graphics, DX10.1 Class iGPU, Shader Model 4.1, Max. shared memory 512MB
  8. Built-in 128MB DDR3 1333/1200MHz SidePort Memory
  9. Multi VGA Output options: D-Sub, DVI-D and HDMI
  10. 1 x eSATAIII Connector, 6 x SATA3 6.0 Gb/s connector, 2 x USB 3.0 Ports, 2 x IEEE1394 Ports
  11. ErP/EuP Ready, Dr. Debug
  12. Smart Swith Design : Power / Reset / Clear CMOS Switch with LED
  13. Turbo 30 GPU Overclocking
  14. Supports ASRock Instant Boot, Instant Flash, OC DNA, OC Tuner, IES, Multi-Speed Fan Control
  15. 7.1 CH HD Audio (VT2020 Audio Codec with QSound), 110dB & Premium Blu-ray audio support
  • Free Bundle: CyberLink DVD Suite – OEM and Trial; Creative Sound Blaster X-Fi MB – Trial
This model may not be sold worldwide. Please contact your local dealer for the availability of this model in your region.

Features

ASRock UCC

UCC (Unlock CPU Core) feature simplifies AMD CPU activation. As long as a simple switch of the BIOS option “Unlock CPU Core”, you can unlock the extra CPU core to enjoy an instant performance boost.

 
more…

ASRock True333

ASRock True 333 motherboard series offer the unmatched performance with the onboard acceleration of the latest USB3.0 with advanced 10X faster speed; SATA3 technology supports up to 12Gbps data transfer speed (via RAID 0), and the most convenient connectivity of eSATA3 devices. To enjoy a completely true computing, ASRock True 333 series motherboards can run the PCI-E for VGA card, SATA3 and USB 3.0 at full speed together simultaneously.

more…

Six-Core CPU Ready

Smart Switch Design

Clear CMOS Switch

Power Switch

Reset Switch
EuP / ErP Reday

EuP / ErP, stands for Energy Using Product, was a provision regulated by European Union to define the power consumption for the completed system. According to EuP / ErP, the total AC power of the completed system shall be under 1.00W in off mode condition. To meet EuP / ErP standard, the EuP / ErP ready motherboard and the EuP / ErP ready power supply are required. (The EuP / ErP ready power supply must meet the standard of 5v standby power efficiency is higher than 50% under 100 mA current consumption.).

more…

Premium Blu-ray Audio

An outstanding technology developed on ASRock motherboard! It provides the excellent audio output of 24-bit/192 kHz with its respective Blu-ray DRM compatible driver/software.
more…

OC DNA

OC DNA, it’s an exclusive utility developed by ASRock’s outstanding RD team, provides a convenient way for user to share the OC settings with others. It helps you to save your overclocking settings under the operating system and simplifies the complicated recording process of overclocking settings. With OC DNA, you can save your OC settings as a profile and send the profile to your friends! Your friends then can load the OC profile to their own system to get the same OC settings as yours!more…

Intelligent Energy Saver

ASRock has overcome the technical obstacles and exclusively invented a new technology that allows you to turn on your PC and boot up to Windows® in 4 seconds! ASRock Instant Boot not only excels in the Boot Up speed (3~4 sec.), it also provides clean OS, and saves the most power energy.

more…

Instant Flash

ASRock Instant Flash is an exclusive and the most user-friendly BIOS flash utility developed by ASRock. It is embedded in Flash ROM which is used to update the system BIOS without having to enter operating systems like MS-DOS or Windows.

more…

ASRock Software Suite

ASRock software suite is designed with the customer-oriented concept, delivers the best possible experience for today’s most demanding users. The Sound Blaster X-Fi MB solution ensures you the premium audio quality, effects and features for PC systems equipped with onboard audio. For instance, the X-Fi CMSS-3D technology expands your stereo audio into surround sound via multi-channel speaker, stereo speaker or even headphone; the X-Fi Crystalizer technology restores the compressed sound source and can even let you hear every detail in riveting surround sound. Combined with the Creative user-friendly software and the ASRock high performance motherboard, you will be assured to enjoy a rich variety of programming and be entertained by a better way.

more…

Dr. Debug

Dr. Debug helps you to diagnose the BIOS POST status of your system.

Heatpipe Design

Heatpipe with fan design for CPU power Mosfet

AMD Radeon HD 4290 DirectX 10.1 Onboard Graphics

Key features of DirectX 10.1 include an updated shader model, improved anti-aliasing support, more flexible data access, and tighter specifications for better applicationcompatibility.

Side port memory 128MB

Boost performance up to 8.13% which is rarely seen on other 890GX boards.

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GIGABYTE Announces USB 3.0 & 3x USB Power “Increase Your Speed, Triple Your Power” Web Contest

Posted on 13 March 2010 by bluetooth

– GIGABYTE Announces USB 3.0 & 3x USB Power “Increase Your Speed, Triple Your Power” Web Contest –

– Send us your creative USB ideas to win a latest GIGABYTE USB 3.0 motherboard –

Taipei, Taiwan, Mar 12, 2010 – GIGABYTE TECHNOLOGY CO., LTD., a leading manufacturer of motherboards and graphics cards today announced the start of the GIGIABYTE USB 3.0 & 3x USB Power web contest, “INCREASE YOUR SPEED, TRIPLE YOUR POWER”. GIGABYTE has recently introduced two exciting new USB features to a full range of their Intel and AMD motherboard product lineup including USB 3.0 compatibility, which delivers a 10x data transfer boost over USB 2.0, and USB Power Boost, which provides additional power and stability for USB devices such as external storage devices or optical drives. In order to showcase these new technologies, GIGABYTE would like to hear from you how you would best use these technologies.

Send us your concepts for USB 3.0 devices or USB devices that can take advantage of a 3x USB Power Boost. Your concepts can include videos, pictures, or just a description of the device. Visitors to the contest website then have the ability to vote for their favorite concepts. In order to help spread the word, contestants have the option to share their creations with their friends via Facebook to help get them the votes they need to win. At the end of the competition, the top three concepts with the most visitor votes will each win a latest GIGABYTE H55M motherboard and an A-DATA NH01 Portable Hard Drive.

GIGABYTE will also play judge by awarding entered concepts points based on creativity, originality and design, with the top 3 concepts chosen by them winning a GIGABYTE GA-P55-USB3 motherboard and A-DATA N002 Combo Flash Drive. Visitors who vote for their favorite concepts also have the chance to win. Each time a visitor votes, they will receive one entry into our lucky draw for the chance to win a yet to be released GIGABYTE GA-880GM-USB3 motherboard based on the AMD 880G North Bridge and SB850 South Bridge. Visitors are allowed to vote up to 10 times per day.

The GIGABYTE INCREASE YOUR SPEED, TRIPLE YOUR POWER web contest ends April 30, 2010. In order to enter the contest, and for complete contest rules, please visit: http://usb3.gigabyte.com.tw/event.

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Kingston Digital Ships 16GB and 32GB SDHC Class 10 Card

Posted on 03 March 2010 by bluetooth

Kingston Digital Ships SDHC Class 10 Card

High Capacity, Fast Card Perfect for Hi-Def Video Capture and Burst Photography

Hsinchu, Taiwan – (March 2, 2010) – Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the release of SDHC Class 10 card. The Kingston SDHC Class 10 card is available in 16GB and 32GB capacities. The card meets the Class 10 data transfer rate specification but has an enhanced performance of up to 22MB/sec. read and 18MB/sec. write*.

 

“As viewing and recording in high definition becomes more popular, the Kingston SDHC Class 10 card’s large storage capability allows users to record hours of video on a single card,” said Nathan Su, Flash Memory Sales Director, APAC Region, Kingston. “The Class 10 speed helps photographers optimize their equipment when it comes to shooting in burst mode as the memory card keeps up with sequential capture.”

 

The Kingston SDHC Class 10 card is designed to meet the SD Association Specification 3.00 with a guaranteed minimum data transfer rate of 10MB/sec. It is the ideal solution for the latest camcorders, digital SLRs and advanced point and shoot cameras. For compatibility, Kingston recommends users look up their device with the Kingston Memory Search tool on the homepage at www.kingston.com/asia.

 

The 16GB Kingston SDHC Class 10 card (Kingston part#: SD10/16GB) and the 32GB card (Kingston part#: SD10/32GB) are all backed by a lifetime warranty, free tech support and legendary Kingston reliability.

 

Kingston SDHC Class 10 Features and Specifications:

·       Capacities**: 16GB. 32GB

·       Dimensions: 0.94″ x 1.25″ x 0.08″ (24mm x 32mm x 2.1mm)

·       Weight: 0.09oz. (2.9g)

·       Performance: Class 10 – 10MB/sec. guaranteed minimum data transfer rate with up to 22MB/sec. read and 18MB/sec. write*

·       Operating Temperature: -13°F to 185°F (-25°C to 85°C)

·       Storage Temperature: -40°F to 185°F (-40°C to 85°C)

·       Voltage: 3.3V

·       Compliant: with the SD Association specification version 3.00

·       Secure: built-in write-protect switch prevents accidental data loss

·       Compatible: with SDHC host devices; not compatible with standard SD-enabled devices/readers

·       File Format: FAT32

·       Reliable: lifetime warranty

·       Simple: as easy as plug and play

 

Kingston SDHC Class 10 Card
Part Number Capacity and Features
SD10/16GB 16GB Class 10 SDHC Card
SD10/32GB 32GB Class 10 SDHC Card

 

SDHC Card Capacity Photo1 Video2
6MP Images 8MP Images 10MP Images 12MP Images 6Mbps HD Extended 9Mbps HD Extended 13Mbps HD Extended
16GB 7624 5080 3208 2708 361 min. 240 min. 166 min.
32GB 15248 10160 6416 5416 542 min. 362 min. 251 min.

(MP=Megapixels: MB=Megabytes, GB = Gigabytes)

 

* Based on internal testing. Performance may vary based on system settings.

** Some of the listed capacity is used for formatting and other functions and thus is not available for data storage.  For more information, please consult Kingston’s Flash Memory Guide at Kingston.com/Flash_Memory_Guide.

1 Approximate number of JPEG (compressed file) pictures. JPEG file sizes vary based upon camera model and internal file size and compression settings, as well as user-selected resolution and compression mode settings. In addition, JPEG compression will result in different file sizes based upon picture complexity. Some host devices may not support all of the Flash storage capacities listed. Consult your device’s owner’s manual for supported capacities.

2 Actual recording time will vary based upon camera model, selected resolution, compression settings and the content being recorded. Some host devices may not support all of the Flash storage capacities listed. Consult your device’s owner’s manual for supported capacities.

 

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[CeBIT 2010] ASUS at CeBIT 2010: Inspiring Innovation for a Better Tomorrow

Posted on 03 March 2010 by bluetooth

ASUS at CeBIT 2010: Inspiring Innovation for a Better Tomorrow

Latest Green, Gaming, Multimedia, and Cloud Computing Innovations Unveiled
CeBIT 2010, HANNOVER, GERMANY (March 2, 2010) — ASUS today showcased a wide spectrum of products and technological advances that embody the company’s “Inspiring Innovation • Persistent Perfection” ethos. Designed on the belief that information technology exists to enhance people’s lives, these innovations bolster, reinvent, or revolutionize the user experience in Green, gaming, multimedia and cloud computing contexts.

Green from the Inside Out
At this year’s CeBIT, ASUS has set aside a special Green Design Product zone to showcase the wide-ranging innovations that empower consumers keen on going Green. The Green innovations employed in the design, development and manufacturing of ASUS’ notebooks, Eee PC™ netbooks, EeeBox PCs, LED monitors and motherboards have garnered the company numerous eco-label certifications. ASUS, for example is the first notebook manufacturer to receive the Environmental Product Declaration (EPD), Carbon Footprint and EU Flower certifications. The foremost of these Green innovations include ASUS’ exclusive Super Hybrid Engine notebook and netbook power management technology that lowers energy consumption well under Energy Star V5.0 requirements, and the Energy Processing Unit (EPU) installed on ASUS motherboards that automatically monitors and adjusts the system’s power requirements to ensure maximum efficiency.

ASUS’ Green advances also extend to material use—illustrated perfectly by the introduction of the U Series Bamboo Collection. U Series Bamboo notebooks take advantage of bamboo’s regenerative and resilient characteristics, reducing plastics usage by 20 percent while lending them an elegant, organic feel.

The Choice of Every Gamer
From hardcore fans of the latest bleeding edge FPS and RPG games, to avid MMO gamers, to casual players of web-based games, ASUS recognizes that there are many different types of gamers—each with distinct needs. ASUS seeks to fulfill these specific needs through its diverse array of products, with the Republic of Gamers (ROG) lineup at the hardcore end of the spectrum, and the Eee PC™ at the casual end. ROG’s claim to fame is its unchallenged dominance in the areas of power, overclockability, and tweakability—rendering its multi-GPU ready motherboards, graphics cards and notebooks the choice of gaming and overclocking champions across the globe.

At CeBIT 2010, ASUS unveiled some of ROG’s most powerful offerings to date, led by the dual Radeon HD5870-sporting ARES, the fastest graphics card in the world, followed by the stealth fighter-inspired G73 notebook which boasts cutting edge specifications and design, and the G51JX 3D, the world’s first notebook to integrate NVIDIA® GeForce® 3D Vision™ for lifelike 3D gaming on the go. ASUS also lifted the curtain on the ASUS VG236H and PG276H, Full HD 3D displays that are set to blow gamers away with eye-popping visuals with sights previously exclusive to the cineplex.

Hearing is Believing: ASUS Establishes a New Standard for Notebook Audio
Audio has always been an area of compromise with notebooks because of the sheer difficulty involved in improving their sonic capabilities. Sparing no expense, ASUS is the first notebook manufacturer to tackle this gap head on, and the result is ASUS SonicMaster. SonicMaster—the result of co-development by ASUS and Bang & Olufsen ICEpower—completely redraws notebook audio. It debuts on new ASUS N Series models (N43, N63 and N73), providing striking audio for people interested in affordable, unflinching quality. Top-line NX Series notebooks feature upgraded SonicMaster capabilities, replacing existing home entertainment hubs.

Poised to Usher in the Cloud Era
Since the launch of the first Eee PC™ in 2007, ASUS has been at the vanguard of providing devices for users looking to get the most out of the cloud. Today, ASUS has solidified its position as the leader in cloud devices with a comprehensive range of netbooks, nettops, E-Readers, home servers, storage systems, media players and networking products that enable users to access and host cloud services, as well as seamlessly share files between devices. On show at CeBIT 2010 are the fourth generation of Eee PCs™—a bold, new collection that sports designs and feature sets tailored for different users, namely social elites, business professionals, everyday mobile Internet users, and tech fashionistas. Among the new models is a premium netbook crafted from aluminum, a first for the Eee PC™ line. Also showcased is the DR-900, a slim and chic 9″ E-Reader with Wi-Fi or optional 3G connectivity that displays crisp, paper-like pages for optimal reading comfort. The DR-900 boasts an incredibly long battery life, enabling users to read over 10,000 pages, or twenty 400-page novels, on a single charge.

In addition to Eee PCs™ and the DR-900 E-Reader, other ASUS devices designed for cloud computing include:

Eee Series PCs: EeeKeyboard PC and EeeTop PC
Media playback: O!Play HD2, the world’s first USB 3.0 media player that provides access to a wealth of cloud infotainment
Networking and storage: TS mini home server, NAS-M25 network-attached storage and RT-N76U router

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[CeBIT 2010] ASUS Goes Green at CeBIT

Posted on 03 March 2010 by bluetooth

ASUS Goes Green at CeBIT

From Notebooks to Motherboards, ASUS Balances Eco-innovation and Design with its Green Design Showcase
CeBIT 2010, HANNOVER, GERMANY (March 2, 2010) — Going Green is a lifestyle choice. At this year’s CeBIT, ASUS has set aside a special Green Design Product zone to showcase Green technology and innovations that empower consumers keen on going Green. ASUS believes that going Green starts within the organization, and promotes environmental responsibility within its workforce and processes. It recently implemented greener manufacturing processes across its product lines—a move which will see it deliver halogen-free products. ASUS’ latest line-up of Green Design technologies, ranging from its notebooks, Eee PCs, EeeBox PC, LED monitors and motherboards, show the world that the company is dedicated to revolutionizing not just the way people work and play, but also how they care for the environment as well.

Green Notebooks—U Series Bamboo Collection
Last year, ASUS became the first notebook manufacturer to receive the Environmental Product Declaration (EPD) and Carbon Footprint certifications. It is also the only notebook manufacturer to receive the EU Flower certificate. These accolades bear testament to ASUS’ commitment to the environment and green product design. And that continues with the introduction of the U Series Bamboo Collection.

A result of ASUS’ Green Material Innovation initiatives, designers have taken advantage of bamboo’s regenerative characteristics and relatively short maturity growth period of 3 to 5 years, and developed the material for the U Series Bamboo Collection’s lid and palm rest. This reduces plastics usage by 20 percent, and gives an elegant and organic feel to the otherwise drab feel of today’s notebooks. On top of that, the U Series Bamboo notebook features a mercury-free LED-backlit panel.

The bamboo theme continues with its 100 percent recyclable packaging, where the material is used as a substitute for paper. Packaging volume is also reduced by 10 percent when compared to other similar products of similar size.

Green Netbooks—Eee PC™ 1005PE
The energy-efficient Eee PC™ 1005PE features a mercury-free LED-backlit panel and the ASUS Super Hybrid Engine power management technology gives it a 14-hour battery life for all-day computing.

The 1005PE’s energy consumption figure is 45 percent less than Energy Star V5.0 requirements. The 1005PE is also certified by EPEAT in North America.

The 1005PE comes packaged in corrugated cardboard with at least 80 percent recycled content. Through a package reduction design process, the final packaging volume is some 11 percent smaller than other similar sized products.

Green EeeBox—EeeBox PC EB1501
The EeeBox PC EB1501 has received EU Flower and EPEAT Gold certifications in Europe and in North America respectively. With a total volume of just 1.5L, the space-saving EB1501 consumes 70 percent less power than a normal desktop PC. With a maximum power supply of 65-watts, its energy consumption figure is 56 percent lower than Energy Star V5.0 requirements, and is well below the 250-watt ratings of most computers today.

Green Motherboards—Protect 3.0
Motherboards are the heart of the system, and ASUS Green Design has come up with a new standard in motherboard protection with ASUS Protect 3.0. This new motherboard design protects the Earth, the system and user.

It features an eco-friendly Energy Processing Unit (EPU) that automatically monitors and adjusts the system’s power requirements to ensure maximum efficiency. Studies have shown that 10 million EPU-enabled motherboards can reduce annual CO? emissions by 210,000 tons—the equivalent of saving 17.5 million trees annually.*

In addition to that, Protect 3.0’s EMI and Anti-Surge features protect users and their systems—reducing radiation exposure by up to 50 percent and preventing electrical surges from damaging the system.

A Green View—Designo LED Monitors
The Designo Series LED monitors (MS248H/ 238H/ 228H/ 208N) feature mercury-free LED-backlit panels that are 45 percent more energy efficient when compared to conventional LCD monitors. These LED monitors reduce CO2 emissions by 30 percent and achieve energy consumption levels lower than the stringent Energy Star V5.0 requirements. In addition, the monitors’ plastic parts are not sent for plating during the manufacturing process, thereby preventing environmental damage and contamination by the plating solutions.

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[CeBIT 2010] ASRock showcase UCC technology, 6 core i7 980X demo, HTPCs at CeBIT 2010

Posted on 03 March 2010 by bluetooth

ASRock create another splash with its new series of mainboards, notebooks and HTPCs at the CeBIT exhibition held in Germany.

At the show, ASRock demonstrates their commitment to technology innovation. The ASRock 890GX Extreme 3 based on the AMD 890GX+SB850 chipsets is one of the AMD 890GX boards that can unlock the hidden cores of your Phenom II processor. The feature is known as UCC.

It also showed a range of Intel and AMD series of boards including the P55 Deluxe 3, X58 Deluxe 3, H55M/USB3, X58 Extreme3. ASRock is going to fore-demo the World’s first Core i7 980X 6-Core CPU running on the feature-complete motherboard – X58 Extreme3. Based on Intel® X58, ASRock X58 Extreme3 supports 6-Core CPU, Dual Channel DDR3 2000(OC), 3 PCIE 2.0 x16 slots, NVIDIA® Quad SLI™, ATI™ CrossFireX™ and Quad CrossFireX™, PCIE Gigabit LAN, IEEE 1394, 7.1 CH, VIA® VT2020 Audio Codec which supports Premium Blu-ray audio. The heatpipe with fan design makes the system cooler than ever! With this fan-heatpipe design, you don’t have to worry the chassis air-flow anymore, you can feel easy to use the water-cooling CPU cooler. In addition to excellent specs, this motherboard also features some ultimate designs include 2 x SATA3 6Gb/s connectors, 1 x Powered eSATAIII/USB2.0 connector, 2 x USB3.0 connectors, smart switch design, Dr. Debug and CPU/Chassis Fan Multi-Speed Control.

ASRock Mini PC Series

New HTPC Season with ASRock Core 100 Series

In addition to the outstanding motherboards, ASRock is proud to release our latest Core 100 HTPC Series at CeBIT 2010. With the intention to present an affordable and functionable HTPC product to users, ASRock announced all series of Core 100 series which includes Core 100HT-BD, Core 100HT and Core 100. Utilizing Intel Core™ i7 / i5 / i3 and Arrandale-based processors, Core 100 series features Intel® HD Graphics that offers great FullHD 1080P performance and energy-efficient capability. Plus, it is the world’s first USB3.0 onboard HTPC on the market. Another “Must-Have” for users to experience is the industry’s highest level of True Blu-ray Video and Audio which can provide you “better than cinema” audio quality and stunning movie experience!

Based on the Intel® HM55 Express chipset, Core 100 series features Dual Channel DDR3 1066 memory, 2 x SO-DIMM slots, Max. 8GB, 2.5” HDD up to 500 GB supports 2nd 2.5” HDD (total up to 1TB). For audio aspect, it supports 7.1Ch HD Audio with THX Trustudio PC feature. Other excellent features include the GLAN, Powered eSATA/USB connects, BD Combo, WiFi 802.11n networking as well as green standards – EuP 2.0 and Energy Star 5.0. What’s more, ASRock Core 100 series even comes with exclusive MCE remote controller with mouse function!

Surprising slim and elegant appearance, ASRock Core 100 HTPC series bring you the best solution for multimedia entertainments and is definitely favored for your ideal HTPC shopping list!

ASRock MultiBook Series

Mobility is Everything – MultiBook M25 / F24

Another great product line is our MultiBook section. In this event, we’re going to demo our latest MultiBook M25 and F24. M25 is a 15 inch notebook and F24 is a 14 inch one that both come with exquisite features and affordable price. ASRock MultiBook M25, adopts the latest Intel® Core™ i5 processor and NVIDIA® GeForce® GT 330M MXM card that delivers solid performance for 3D games and everyday applications. ASRock MultiBook M25 & F24 come with excellent specifications and features, such as ASRock Multi-Touch trackpad, 802.11b/g/n wireless LAN, Bluetooth, HDMI, Powered eSATA/USB connector, 16:9 widescreen HD Glare Type LCD, 1.3M camera, and Full-size keyboard with numeric key. Multi-Touch trackpad allows you to maneuver your notebook tasks with simple gestures. Just enjoy scrolling up and down a webpage, zooming in and out an image, back or forth through browsing on the web by finger dancing with ASRock Multi-Touch trackpad.

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[CeBIT 2010] MSI showcase Win Top AE2200 AIO PC, GT660 Notebook, Big Bang series of motherboards

Posted on 03 March 2010 by bluetooth

A New Generation of High Performance
MSI’s New Products Shine at CeBIT 2010!
Mar. 2nd, 2010

MSI President Joseph Hsu says that the Wind Top AE2220 combines a stylish and aesthetic design with the latest technology. It has also garnered much praise from media present at CeBIT.

MSI’s All-in-One PC shines bright at CeBIT 2010! With its innovative technology and extraordinary styling, the Wind Top AE2220 has won the prestigious CeBIT Preview Award for 2010. The CeBIT Preview Award is granted by a panel of 300 local German professional media organizations after reviewing the year’s best products introduced at the tradeshow. The CeBIT Preview Award is widely regarded as objective recognition of product excellence. MSI’s AIO Wind Top AE2220 is the only All-in-one touch-screen product to have been awarded this coveted prize! It boasts a large 22-inch multi-touch screen with Windows® 7 and MSI’s exclusively developed intuitive touch-screen software. With its 16:9 cinematic, Full HD 1080p ultra-high-resolution screen, brilliant video effects can be fully realized. Combined with the powerful Intel® Core 2 Duo/Pentium processor and NVIDIA® ION graphics processor, multitasking is a breeze. The model is also equipped with wireless Internet access, and through the touch of a single finger, users can enjoy powerful multimedia features or surf the Net. The Wind Top AE2220 combines a stylish and aesthetic design with the latest technology. It has also garnered much praise from media present at CeBIT, who all gave it a resounding thumbs-up. In addition, MSI’s 3D All-in-One touch-screen technology was the focus of the show on opening day. With this new 3D touch-screen All-in-One PC, all a user needs to do is put on a pair of 3D glasses and touch the screen directly to experience immersive 3D images via the Full HD, 120Hz LED panel!
MSI President Joseph Hsu says that his company’s laptops and All-in-One PC products have equal emphasis on both style and performance, and this is evident from the very warm response the company has received from consumers. “With both commercial and consumer dimensions, MSI is definitely the pioneer to promote All-in-One PC worldwide,” said Joseph.

In addition to its star products, MSI is also introducing a full range of laptop models, the All-in-One PC Intel® CoreTM series and the Green Wind Top series.

GT 660 Notebook, the Best Audio Experience
MSI has collaborated with top audio equipment manufacturer Dynaudio to unveil its GT660 laptop with built-in Dynaudio technology. “We are very happy to cooperate with MSI to show that sound can be much better in computers,” said Wilfried Ehrenholz, CEO of Dynaudio International GmbH. GT660 displays the world’s only built-in LED light show technology, allowing users to experience the highest level of enjoyment whether they are playing games, watching movies or listening to music. “We try to deliver the best audio experience to the users with this brand new notebook, and it is a very successful product which we are proud of,” said Sam Chern, MSI Notebook Marketing Director.

“We are very happy to cooperate with MSI to show that sound can be much better in computers,” said Wilfried Ehrenholz, CEO of Dynaudio International GmbH.Sam Chern, MSI Notebook Marketing Director, says that MSI GT660 notebook delivers the best audio experience.

Besides, this year’s theme “Performance?Sound?Vision” also symbolizes MSI’s five major leading and innovative technical indicators of Notebook, which include their exclusive TDE overclocking and cooling technology, GPU Boost intelligent power management technology, Cinema Pro high quality imaging technology, outstanding audio technology, as well as award-winning and stylish ultra-light and slim designs. On display at the exhibition venue are the Wind U160 and the X-Slim X620, which have just won Germany’s iF Design Award for 2010, both of which are ground breaking laptop products designed with both style and performance in mind.

The Ultimate in Performance! Big Bang Series Mainboards Now Invading the Gaming Market

MSI Mainboard Marketing Director, Jason Lee, said that the Big Bang series gaming mainboards have been widely praised by consumers since their debut last year.
MSI Mainboard Marketing Director Jason Lee said that the Big Bang series of mainboards have been designed exclusively for the gaming market, and have been widely praised by consumers since their debut at the end of last year. The product that has received the most attention is the Big Bang-Fuzion mainboard, which is equipped with an exclusive Hydra Engine graphics chip developed by Israeli developer Lucidlogix. Gamers are no longer limited by specific manufacturers or graphics chips and will be able to use the Hydra Technology to upgrade their systems easily. To show how MSI has adopted its strategic “Performance?Sound?Vision” product development strategy, the Big Bang series of mainboards are equipped with exclusive THX® TruStudio PC™ and Creative EAX® ADVANCED HD™ 5.0 audio technology, capable of offering full 3D audiovisual effects.

Also on display in MSI’s graphics card product line at the exhibition is the company’s top video card product, the R5870 Lightning, which boasts the highest performance and unmatched specifications on the market. “Lightning currently is the world record of overclocking and is the best graphic card in the world,” said Jason Lee. In addition, the highly acclaimed Afterburner multi-purpose overclocking software that was introduced last year has been updated for this year’s CeBIT, together with the well-received Twin Frozr II dual-fan cooling unit. Jason Lee says that these products have taken into consideration hardware, software and cooling designs, indicating that MSI is once again creating an all-new graphics card performance benchmark for the industry.

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Samsung Unveils New NX Range Lens Technology Line Up

Posted on 02 March 2010 by bluetooth

Samsung Unveils New NX Range Lens Technology Line Up

The NX10’s innovation continues, with the launch of eight new lens technologies

 SEA FORUM, SINGAPORE – March 2, 2010 – Samsung Digital Imaging Co., Ltd., a market leader and award?winning innovator in digital imaging, today announced a series of new additions to its groundbreaking NX system lens technology. The original line up of Pancake, Standard Zoom and Tele Zoom lenses launched with the Samsung NX10 during CES will be complemented by the introduction of a further five new lenses this year. This will mean that there will be a total of eight lenses designed specifically for the NX camera system will be available by the end of this year.

The lenses have each been specifically designed to ensure that users get the most out of their photography experience. The NX system’s advanced intelligent lens technology means it does the capturing while users do the creating, providing an enjoyable photography experience every time. The NX10 boasts a compact, sleek and lightweight design, and now with its leading lens technology, users never need to miss a creative moment, even in the flash of a second.

Consumer research carried out by Samsung revealed that camera users want convenient and easy-to-use features which guarantee value and creative freedom through innovative concepts. Samsung’s intelligent lens technology ensures users’ needs are fulfilled with the highest picture quality, sleek, durable and portable design. Building on the company’s strong heritage in performance and innovation, Samsung’s new lens technology is designed to deliver greater ease-of-use for users worldwide.

The eight lenses incorporate unique features and designs to guarantee that the images produced are easy to create yet still of professional quality. The lenses have been developed to provide specific benefits which respond directly to the consumer needs and desires highlighted in the research.

Consumers reported that they wanted lenses which are small and convenient to carry, yet still stylish and iconic. In response to this, Samsung has created the Compact Zoom Lens, the Wide Lens and the Pancake Lens – all of which give users a high level of optical performance without the bulk of other lenses on the market. These are ideal for consumers who want a lens they can take anywhere and everywhere that will complement the compact, sleek and stylish design of their NX10.

For consumers who are looking for specific qualities to their shots, be it capturing with a certain focus or depth of perspective, Samsung has released the Tele Zoom Lens, the Macro Lens and two types of Standard Zoom Lenses. These lenses feature intuitive technology and are optimised for professional results by delivering the ultimate in performance.

Finally, Samsung found that many people are looking for all-round quality and durability in a multi-purpose lens which can perform faultlessly in a number of situations. For this, the Super Zoom Lens is the perfect choice.

“We were inspired to create new lines of cameras and lenses that would change the way people think and feel about photography. This could only be achieved by ensuring all of the NX10’s components represented an intuitive and harmonious design with capabilities to meet the needs of our customers,” explained Mr. S J Park, CEO of Samsung Digital Imaging. “We know from our detailed research that what consumers want from their cameras is evolving – they’re looking for compact and stylish products of a high performance, while retaining a focus on value. We’ve reflected these demands throughout the development of our lens technology for the NX10 and forthcoming NX range.”

He added: “Samsung has always been quick to implement cutting-edge technology, and the development of our lens technology ensures that the highest image quality is guaranteed, and always within reach of all our users. Our continued commitment to improving the imaging experience of our users is a number one priority – we don’t want our users to just capture images but to create their own unique stories. The Samsung NX10 represents a whole new category of digital cameras and the new offerings within our lens line up will ensure that our users feel empowered to unleash their creative sides and integrate camera technology into everyday life, in their own special ways.”

NX10 LENS TECHNOLOGY SPECIFICATIONS

 

       NAME Specification 
Pancake Lens(Jan 2010) 30mm F2
Standard Zoom Lens(Jan 2010) 18-55mm F3.5-5.6 OIS
Tele Zoom Lens(Jan 2010) 50-200mm F4-5.6 OIS
Standard Zoom Lens(H1 2010) 18-55mm F3.5-5.6, Non OIS
Compact Zoom Lens (H2 2010) 20-50mm F3.5-5.6
Wide Pancake Lens (H2 2010) 20mm F2.8
Super Zoom Lens  (TBD) 18-200mm F3.5-6.3 OIS
Macro Lens  (TBD) 60mm F2.8

 

* Lens specs and launch dates are subject to change without notice.

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Samsung SEA Forum Coverage – Samsung launches 3D TV, cameras, notebooks

Posted on 02 March 2010 by bluetooth

Samsung Showcases Product Lineup for Continued Growth in
Southeast Asia & Oceania at Inaugural Samsung Regional Forum
 
Full HD 3D Solution to Be Available this month; Digital Camera, IT and Home Appliance Categories Key Strategic Areas for Region’s Success in 2010
 
SEA FORUM, SINGAPORE – March 2, 2010 – Samsung Electronics Co. Ltd. set an exciting course for continued growth in the Southeast Asia & Oceania region today as the inaugural Samsung Southeast Asia & Oceania Forum opened at the SUNTEC Singapore Convention Center. Samsung unveiled its breakthrough lineup of Full HD 3D solutions that will be available to the Southeast Asia & Oceania market later this month. The company also showcased innovative new offerings in the areas of digital imaging and home appliance and aggressive growth plans in the IT sector.
 
Before hundreds of media and partners, a team of executives from throughout Samsung Southeast Asia & Oceania led a showcase of Samsung’s 2010 product lineup, highlighted by the company’s award-winning solution of full HD 3D entertainment products announced earlier this year. A range of new home appliance products was highlighted by the union of sleek design and advanced technology in the areas of refrigerators and washing machines. The display division heralded the arrival of Samsung’s new eBook while the newly merged PC and printer divisions showed off a new design ID for notebooks and netbooks as well as one-touch functionality for all printers.
 
For more details please read
http://www.ocworkbench.com/2010/SAMSUNG/Samsung-SEA-Forum/p1.htm

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[CeBIT 2010] Sharkoon announces “Rush” waterproof mouse pad at CeBIT 2010

Posted on 26 February 2010 by bluetooth

Waterproof Textile Mouse Pad for Gamers

Heavy duty textile pad in large format with 444 x 345 mm / MSRP 14.99 euros

Sharkoon has now expanded it’s specifically designed for gamers “Rush” product series to mouse pads: The Sharkoon Rush Gaming Mouse pad in its large size defines itself with precise sliding qualities and also with a new, strainable textile surface in particular for demanding PC gamers.

Exceptional tightly woven fibers and an elaborate manufacturing process ensure the texture is abrasion resistant and water proof. Dust, crumbs, and liquids will not penetrate into the fabric and can simply be wiped off. Ruinous and unattractive coffee or sweat stains are a thing of the past. In addition, the granular texture ensures fast and precise mouse movements with the rubberized base keeping the pad in place even in the most hectic situations.

The mouse pad has a thickness of 4mm and offers a 444mm x 345mm edge length which provides a generous action surface particularly for the Low-Sense-Gamer, who plays with less mouse resolution and requires freedom of movement. The cloth pad is suitable for all mouse types, and the mouse pad can simply be rolled together for easy transport.

The Rush Outplay has already successfully passed the test of a demanding gamer. Jan “moon” Stolle, who is a multiple German Counter-Strike 1.6 champion with “Team ALTERNATE,” provides the assessment: “The pad has a very fast surface due to the special yarn used. The Slap Stick Effect (Status Friction Effect) is reduced to a minimum by the rough surface texture. Therefore, even smaller mouse movements are extremely precise! The sensitivity remains constant during a long period. For me, a genuine alternative to my plastic pad! My recommendation!”

End customers will find the Sharkoon Rush Outplay Gaming Mouse pad available immediately for the retail price 14.99 euros in authorized retailers.

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[CeBIT 2010] ASRock to showcase X58 Extreme3 running Core i7 980X 6 core CPU, netbooks at CeBIT 2010

Posted on 26 February 2010 by bluetooth

Ultra fast, ultimate performance & enhanced components – ASRock X58 Extreme3 is one of the most advanced True 333 (USB3.0, SATA3, eSATA3) series motherboard! Highlights of this year’s CeBIT Show, ASRock is going to fore-demo the word’s first Core i7 980X 6-Core CPU live show. Also, ASRock’s latest NetTop Core 100 series and MultiBooks will be showcased in this event! Take a look of our new collections and you will be amazed even more pleasure!

February. 26, 2010, Hannover, Germany – A coming wave of PC: pursuing the faster data transfer performance and storage capability, usher in a new era of extreme-speed computing. But have you ever experienced the true computing? ASRock, a global leading IT brand, struggles to provide the breakthrough well-rounded solutions for users to experience the real speed computing at the world’s famous IT technology tradeshow, CeBIT 2010 in Hannover, Germany, from March 2nd to March 6th at Hall 17, Stand C50. The best new hardware and software will be showcased during the show, including: motherboards, NetTops, MultiBooks and more. All you have to do is just come to ASRock CeBIT 2010 show, and you will be assured in the know!

ASRock Motherboard Series

Blisteringly Fast – ASRock Exclusive True 333 Series Motherboards

Fully Deliver USB 3.0 and SATA3 Bandwidth Without Sacrificing Graphics PCI-E X16 Bandwidth

Today’s motherboards hardly resemble the real computing. Whatever your reason for needing a faster system, we’ve got a host of technologies to improve your computing experience. The ASRock True 333 onboard motherboards born to bring the truth and sets an exactly true computing standard by combining the world’s highest speed transfer technologies. As the industry’s leader, ASRock is keen on providing the most demanding technology and has once again proof its innovative capability by True 333 series mainboards. ASRock True 333 series motherboards deliver the unmatched performance with the onboard acceleration of the latest USB3.0 (5Gb/s) from NEC with advanced 10X faster speed; SATA3 technologies from Marvell with up to 6Gb/s data transfer speed, and the most seamless connectivity of eSATA3 devices.

ASRock True 333 Bridge

As we know, Intel P55 Chipset only provides PCI-E 1.0 x1 bandwidth (2.5GT/s). However, it is definitely not enough for the latest SATA3 (6Gb/s) and USB 3.0 (5 Gb/s) bandwidth. Other 333 series motherboard may use the PCI-E 2.0 lane which comes from CPU for the SATA3 and USB 3.0, but it will suffer the PCI-E VGA slot downgrade from x16 to x8 or can’t run SLI/CrossFire. Thus, ASRock integrates the True 333 Bridge on P55 Deluxe3 and it provides the PCI-E 2.0 bandwidth for SATA3 and USB 3.0. Visit ASRock at CeBIT 2010, and you will be stunned by our ASRock P55 Deluxe3!

ASRock True 333 V.S. Other 333

Unprecedentedly, ASRock True 333 series motherboards can run the PCI-E for VGA card, SATA3 and USB3.0 at full speed together simultaneously. However, other 333 series motherboards can only run one of them at full speed at one time. If you are an eagle-eyed user looking for the true exciting computing, do not forget the come to experience the new wonder of ASRock located at Hall 17, Stand C50. Trust us! ASRock True 333 series motherboard can satisfy you with a completed and qualified PC experience!

Upgrade your system for free? World’s First AMD 890GX motherboard supports Unlock CPU Core –

ASRock 890GX Extreme3 supports ASRock UCC Feature!

Do you desire for the free upgrade? Of course, you do! Different from the traditional AMD motherboard, ASRock 890GX Extreme3 makes a new definition of how a motherboard will be used! It is a new upgradeable motherboard usage that users enable the ASRock UCC (Unlock CPU Cores) feature in BIOS, and the CPU cores could be upgraded from X2/X3 to X4. ASRock UCC simplifies AMD CPU activation. Just a simple switch of the BIOS option ‘UCC’, you can unlock the extra CPU core to enjoy an instant performance boost. Additionally, some CPU can even increase L3 cache size up to 6MB. Not only on AMD 8xx series motherboards, we implement the UCC feature on entry Nvidia N68 series motherboards as well. It is also the World’s First Nvidia Chipset motherboard supports “Unlock CPU Core”!

(Please be noted that UCC feature is supported with AM2+ / AM3 CPU only, also, not every AM2+ / AM3 CPU can support this function because some CPU’s hidden core may be malfunctioned.)

System Performance Boosts Up to 50% Increase by Turbo 50 – H55 series mainboards

As anyone who has overclocking experience knows, choosing a powerful motherboard is the crucial element for overclocking performance. ASRock H55 series motherboards come with the exclusive Turbo 50 technology which can smash your board’s performance limits and boost up to 50% increase by automatically overclocking all related settings! Simply click the Turbo 50 button in BIOS, the system performance will boost up to 50% increase by automatically overclocking CPU, Memory, GPU frequency and all related voltage settings! If 50% performance increase still can not satisfy you, how about 100%? With PentiumG 6950 processor, ASRock H55 series motherboards even supports Turbo 100! – Performance boots up to 100% increase by One Simple Click!

At ASRock, we do not merely pursue excellent – we also strive for the absolutely perfection in everything we do. In fact, our efforts have been recognized in the form of numerous professional media accolades! Currently, H55M Pro was proudly received The Most Recommended H55 MB from Tom’s Hardware Guide (THG), and was honored as the Best Recommended Motherboard by the AnandTech System Buyers Guide. Combined with ASRock exclusive Turbo 50 technology and ASRock H55 motherboard, your system performance will be increased up to 50% effortlessly. At CeBIT show, you can see the full ranges of ASRock H55 platform motherboards! Come to the show and check out by yourself!

World’s First Core i7 980X 6-Core CPU Live Demo – X58 Extreme3

This year, the hottest PC topic is definitely going to the Intel upcoming Six-Core CPU. During the CeBIT event, ASRock is going to fore-demo the World’s first Core i7 980X 6-Core CPU running on the feature-complete motherboard – X58 Extreme3. Based on Intel® X58, ASRock X58 Extreme3 supports 6-Core CPU, Dual Channel DDR3 2000(OC), 3 PCIE 2.0 x16 slots, NVIDIA® Quad SLI™, ATI™ CrossFireX™ and Quad CrossFireX™, PCIE Gigabit LAN, IEEE 1394, 7.1 CH, VIA® VT2020 Audio Codec which supports Premium Blu-ray audio. The heatpipe with fan design makes the system cooler than ever! With this fan-heatpipe design, you don’t have to worry the chassis air-flow anymore, you can feel easy to use the water-cooling CPU cooler. In addition to excellent specs, this motherboard also features some ultimate designs include 2 x SATA3 6Gb/s connectors, 1 x Powered eSATAIII/USB2.0 connector, 2 x USB3.0 connectors, smart switch design, Dr. Debug and CPU/Chassis Fan Multi-Speed Control.

ASRock Mini PC Series

New HTPC Season with ASRock Core 100 Series

In addition to the outstanding motherboards, ASRock is proud to release our latest Core 100 HTPC Series at CeBIT 2010. With the intention to present an affordable and functionable HTPC product to users, ASRock announced all series of Core 100 series which includes Core 100HT-BD, Core 100HT and Core 100. Utilizing Intel Core™ i7 / i5 / i3 and Arrandale-based processors, Core 100 series features Intel® HD Graphics that offers great FullHD 1080P performance and energy-efficient capability. Plus, it is the world’s first USB3.0 onboard HTPC on the market. Another “Must-Have” for users to experience is the industry’s highest level of True Blu-ray Video and Audio which can provide you “better than cinema” audio quality and stunning movie experience!

Based on the Intel® HM55 Express chipset, Core 100 series features Dual Channel DDR3 1066 memory, 2 x SO-DIMM slots, Max. 8GB, 2.5” HDD up to 500 GB supports 2nd 2.5” HDD (total up to 1TB). For audio aspect, it supports 7.1Ch HD Audio with THX Trustudio PC feature. Other excellent features include the GLAN, Powered eSATA/USB connects, BD Combo, WiFi 802.11n networking as well as green standards – EuP 2.0 and Energy Star 5.0. What’s more, ASRock Core 100 series even comes with exclusive MCE remote controller with mouse function!

Surprising slim and elegant appearance, ASRock Core 100 HTPC series bring you the best solution for multimedia entertainments and is definitely favored for your ideal HTPC shopping list!

ASRock MultiBook Series

Mobility is Everything – MultiBook M25 / F24

Another great product line is our MultiBook section. In this event, we’re going to demo our latest MultiBook M25 and F24. M25 is a 15 inch notebook and F24 is a 14 inch one that both come with exquisite features and affordable price. ASRock MultiBook M25, adopts the latest Intel® Core™ i5 processor and NVIDIA® GeForce® GT 330M MXM card that delivers solid performance for 3D games and everyday applications. ASRock MultiBook M25 & F24 come with excellent specifications and features, such as ASRock Multi-Touch trackpad, 802.11b/g/n wireless LAN, Bluetooth, HDMI, Powered eSATA/USB connector, 16:9 widescreen HD Glare Type LCD, 1.3M camera, and Full-size keyboard with numeric key. Multi-Touch trackpad allows you to maneuver your notebook tasks with simple gestures. Just enjoy scrolling up and down a webpage, zooming in and out an image, back or forth through browsing on the web by finger dancing with ASRock Multi-Touch trackpad.

The Must See IT 2010 Tradeshow First at ASRock CeBIT, Hall 17, C50.

With a vast collection of product solutions, covering from motherboards, NetTops and MultiBooks, CeBIT visitors will gain insights into ASRock cutting-edge technologies with a wide range of futuristic technologies being showcased. After having a first look at all above ASRock new products, I suppose you’ll desire to know the whole show. Just visit ASRock CeBIT2010 tradeshow and you will be in the front row of IT trend! Trust us! Come to ASRock CeBIT2010 and you will be stunned by our superb hardware components, system performance and find out even more pleasure!

About ASRock Inc.
ASRock Inc., established in 2002, is an energetic company with the combination of technology innovation and humanity. Devoting efforts to bringing customers the innovative and reliable motherboards with the design concept of 3C, “Creative, Considerate, and Cost-effective “, ASRock has successfully established a well-known brand as the best price-performance motherboard maker in the industry.

Moving with the trend of PC technology, ASRock will always keep the commitments of creating products of best value for worldwide users. We always provide our users products with forward-looking vision.

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Kingston Digital Ships Speedy 16GB microSDHC Class 10 card

Posted on 26 February 2010 by bluetooth

Kingston Digital Ships Speedy Class 10 MicroSDHC Card

Large Capacity, Fast Performance a Perfect Match for Memory-Hungry Devices

 

Hsinchu, Taiwan – (February 24, 2010) –Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the release of a 16GB microSDHC Class 10 card. The high-capacity card complies with the SD Association Specification 3.00 to meet Class 10 requirements. The 16GB microSDHC card has a minimum data transfer rate of 10MB/sec. and ships either as a stand-alone microSDHC card or with adapters.

 

“With the new speed class, host devices such as high-definition cameras or the latest smartphones are being designed to optimize their write performance to take advantage of the more responsive memory card speeds,” said Nathan Su, Flash Memory Sales Director, APAC Region, Kingston. “Now that the Class 10 card specification is five times faster than a Class 2 card, users will see swifter copying and transferring of photos, music, videos and e-books when using a multi-format card reader such as the Kingston Media Reader or MobileLiteG2 with a PC.

 

Kingston takes mobility and versatility a step further with the addition of the SD adapter pack (Kingston part #: SDC10/16GB), and the SD and miniSD adapter pack (Kingston part #: SDC10/16GB-2ADP). Inserting the card into the SD adapter turns it into a large-storage, speedy SDHC card that can be used to capture continuous images or videos in digital cameras. Kingston also includes an adapter for other devices that utilize the miniSD form factor. Either adapter pack allows users to store all data on one card across multiple Class 10 device platforms.

 

The 16GB microSDHC Class 10 card is backed by a lifetime warranty, free tech support and legendary Kingston reliability. For more information visit: www.kingston.com/asia.

 

Kingston 16GB microSDHC Class 10 Features and Specifications:

·       Compliant: with the SD Specification Version 3.00

·       Versatile: when combined with an adapter, can be used as a full-size SDHC card with write protection or as a miniSDHC card to transfer data

·       Compatible: with microSDHC, miniSDHC and SDHC host devices; not compatible with standard microSD-enabled device/readers

·       File Format: FAT32

·       Reliable: lifetime warranty

·       Capacities*: 16GB

·       Dimensions: 0.43″ x 0.59″ x 0.039″ (11mm x 15mm x 1mm)

·       High-Speed Class Rating: Class 10 – 10MB/sec. minimum data transfer rate

·       Operating Temperature: -13°F to 185°F (-25°C to 85°C)

·       Storage Temperature: -40°F to 185° (-40°C to 85°C)

 

*Some of the listed capacity is used for formatting and other functions and thus is not available for data storage.  For more information, please consult Kingston’s Flash Memory Guide at Kingston.com/Flash_Memory_Guide.

 

Kingston 16GB microSDHC Class 10 Card
Part Number Capacity and Features
SDC10/16GBSP 16GB microSDHC Class 10 single pack (card only)
SDC10/16GB 16GB microSDHC Class 10 card with SD adapter
SDC10/16GB-2ADP 16GB microSDHC Class 10 card with two adapter pack (miniSD & SD adapter)

 

To discuss this product on Kingston Blog, please go to www.kingston-blog.com. To try the game “Challenge Your Memory”, please go to

www.kingston-blog.com/challenge_your_memory/en/. To get the freshest information on Kingston, please go to http://twitter.com/KingstonFEPR.

 

To find out if your Kingston product is genuine, Kingston also provides an online verification site: www.kingston.com/asia/verify. To try the game “Search for Genuine Kingston”, please go to anti-counterfeit.kingston-blog.com. For the interesting animation: The Adventures of Rex, please visit: www.theadventuresofrex.com.

 

About Kingston Digital, Inc.

Kingston Digital, Inc. (KDI) is the Flash memory affiliate of Kingston Technology Company, Inc., the worlds largest independent manufacturer of memory products. Established in 2008, KDI is headquartered in Fountain Valley, California, USA. For more information, please visit www.kingston.com/asia.

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[CeBIT 2010] Biostar to unveil high performance mainboards H55HD, TA890GXE and technologies “GTO 63 on TA890GXE”, “BIO-unlocKING” Technology at CeBIT 2010

Posted on 24 February 2010 by bluetooth

BIOSTAR Unveils High Performance MB and Technologies at Cebit, 2010

Taipei, Taiwan; Feb 25, 2010 – Year by year, the demand for high performance components has been increasing in the realm of computing. In catering to such demands and expectations, BIOSTAR, a leading company in the new digital era, has developed innovative technologies that allow users to achieve the best possible performance and is set to highlight these during Cebit 2010.

“H55 HD MSRP @ US$75”

BIOSTAR is taking another giant step releasing latest Intel H55 chipset based motherboard – “H55 HD” with MSRP price point at US$75 in selected sales channels. “H55 HD”, micro-ATX form factor with black color PCB design, supports Intel newest 45/ 32nm Clarkdale Core i3/ i5 processor with integrated Intel GMA HD graphic engine built in. It also adopts 5 phase X.D.C solid state power supply; each phase supplies 3 MOS to secure extremely steady power supply and a great enhancement for over clocking. Again, “H55 HD” another perfect choice for your “Home Entertainment” with interfaces of HDMI + DVI + VGA output; one Gigabit LAN connector; USB 2.0 and PS/2 for keyboard and mouse; and Realtek 5.1 channel HD Audio.
“Game Boost – GT60 Technology”

“Game Boost – GT60” Technology allows users to increase GPU clock speed on Intel Clarkdale processors effortlessly. This unique development is now adopted on BIOSTAR “H55” series motherboards, users are able to adjust integrated GPU frequency and voltage freely to enhance system overall gaming performance up to 60% and more.                        http://www.biostar.com.tw/app/en/event/game_boost/index.htm

TH55 XE / Core i3 530 GPU Clock: 63.7 % Up, 3Dmark 06 Boost: 60% up

CPU Freq. GPU Freq. 3DMARK 06 Increased
Intel Default 2.93GHz 733MHz 1705
Biostar Default 3.0GHz 766MHz 1790 3.7%
GPU Enable 4.4GHz 1200MHz 2724 60%

“BIO-Remote Utility”

“BIO-Remote Utility”, with on-board Consumer IR header comes with a MCE Remote Controller certified by Microsoft makes a perfect combination for your in-home entertainments. “BIO-Remote” works with the MCE in Windows 7 to easy access TV, Music, Photo, DVD all kinds of digital media; users can enjoy the digital contents from anywhere. Friendly on-screen menu is special designed for remote control interaction that provides fun, energizing and integrated digital media experiences. The “BIO-Remote Utility” and “Remote Controller Set” are available on selected motherboard series including Intel H55, AMD 890GX series and more.

“AMD890GX chipset MB – TA890GXE”

Along with AMD’s new890GX chipset launch on March 2nd, BIOSTAR demonstrates its T-Series family “TA890GXE” constructed supporting AMD latest “Leo” Enthusiast platform with AM3 processors as well as upcoming “Thuban” Phenom II X 6 six- core processor and DDR3 support. With internal graphics core at 700MHz, DX10.1 and UVD 2.0 support, it can be setup to run Asymmetric CrossFire. Other features include HDMI 1.3a, DVI-D Dual Link, Optical S/P DIF HD Audio output, 8+2Ch Blu-Ray Audio Ready, SATA3 (6Gbps), e-SATA, IEEE 1394, on-board 128M DDR3 side port memory, GbE LAN, 8 channel audio support, and 100% X.D.C Japanese solid capacitor. In addition, it also adopts BIOSTAR unique “D.P.U – Digital Power Unit”, “G.P.U II – Green Power Utility”, and “BIO-Remote Utility”.

“GTO 63 on TA890GXE”

“GTO 63” represents high speed transfer technology, six core processor support, and extreme overclocking.

l  GT60 – BIOSTAR exclusive technology enhance GPU clock speed 60%+.

l  SATA 6Gbps – maximum hard disk transfer rate, 2 times faster than SATA 2.

l  Phenom II 6 core processor support – meet future demand today.

“BIO-unlocKING” Technology

“BIO-unlocKING” technology, the easiest way to activate ACC function from AMD processors. AMD AOD w/ACC feature (advanced clock calibration) has been a super hot topic last year. Users now able to enable the ACC function and unlock the extra 3rd or 4th core with a super-simple 1 click from keyboard; furthermore, we offer users to choose the specific core(s) depending on system environment. Users can even turn off some surplus core(s) for power saving purpose.                            http://www.biostar.com.tw/app/en/event/biounlocking/index.htm

Come to see us live at Cebit, Hannover or visit www.biostar.com.tw for more information.

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[CeBIT 2010] Gigabyte launches Ultimate Super Overclock Graphics card series by GPU Gauntlet Sorting process

Posted on 22 February 2010 by bluetooth

– Optimal GPU Overclocking with GIGABYTE’s Ultimate Super Overclock Series –

– Premium Graphics Card with GPU Gauntlet™ Sorting and Ultra Durable VGA, GIGABYTE HD 5870 SOC Hot Launch at CeBIT –

 

Taipei, Taiwan, 22nd February, 2010 – GIGABYTE, a leading manufacturer of motherboards and graphics cards, grandly introduces a powerful new addition to its product lineup: the Super Overclock Series. All of the GPUs in this new range of high-end graphics cards have been cherry-picked for top performance, efficiency and reliability. Utilizing GIGABYTE’s innovative GPU Gauntlet™ Sorting process ensures that only premium GPU processors are used in these graphics cards. Coupled with Ultra Durable VGA boards, users can rest assured that the Super Overclock Series graphics cards won’t let them down when they step onto the digital battleground.

GPU Gauntlet Sorting

First, GIGABYTE’s database analysis system evaluates the GPU core engine, shader engine and memory.  If a processor doesn’t meet the pre-defined standard, it will not qualify for the Super Overclock Series.

In addition, GIGABYTE’s proprietary testing toolkit allows engineers to inspect and select the GPUs with the highest frequency. This program operates for 30 minutes and provides important data on the maximum overclocking ability when compared to a stock GPU. Once the Super Overclock point has been determined, engineers will boost the frequency to offer the highest factory default clock setting in the market

Next, each Super Overclock Series GPU faces the Graphics benchmarks, FurMark and 3DMark Vantage, to measure performance and stability under an intense graphics load. A GPU that passes this stage will perform at a lower temperature and fan speed compared to a standard GPU. By choosing the cream of the crop, GIGABYTE ensures rich rendering of intricate 3D scenes and realistic physical effects such as water, gas, steam, fire, etc for a lifelike gaming adventure.

Last but not least, engineers test the power switching and stability. The GPUs with the best power efficiency and lowest power consumption qualify for the Super Overclock Series. And GIGABYTE understands that premium graphics cards should not sound like a cement truck rolling down the freeway, so a large cooling fan provides for a quiet computing environment.

Thanks to Ultra Durable VGA 5 quality components, 2 oz copper PCB, first tier memory, Japanese solid capacitors, ferrite core chokes and low RDS (on) MOSFET, the Super Overclock Series provides for top performance in graphics benchmarking. These high-quality components promise consumers 5%~10% lower GPU temperatures, 10-30% higher overclocking capability, and switching power loss that is reduced by 10-30%

GIGABYTE’s innovative GPU Gauntlet™ Sorting process provides three main benefits:

Full-throttle Performance Tuning

Proprietary database analysis system helps engineers investigate GPU core, shader and memory.

Optimized Thermal Efficiency

With high-quality Gigabyte Ultra Durable VGA components, the processor selected by GPU Gauntlet™ Sorting boasts extra lower temperature by 5 to 10%. The guarantee fan speed at 1500 rpm in high-rated 3D and physics-accelerated games helps reduce noise for an absolutely quite environment.

Expert Power Switching

GPUs are examined and tested for the highest power efficiency and lowest power consumption using the FurMark and 3DMark Vantage benchmark. Taking GIGABYTE GTX 260 Super Overclock Series graphics card for example, it delivers a 25% increase in performance compared to a standard GTX 260 card. And a GIGABYTE GTX 260 Super Overclock Series card guarantees the same overclocking capability as a standard GTX 260 dual-fan video card, but with lower power consumption.

Built for OC Competition & Gaming Battle

Serious gamers require serious gear. That is why GIGABYTE has developed the Super Overclock Series. The Super Overclock Series is built for OC competition and gaming battle and has been heavily used in competition. The GIGABYTE Super Overclock Series has proven time and time again to be an amazing overclocking GPU, continually allowing users to break and set higher and higher new world records. The GIGABYTE graphics card world record ceiling has possibly been reached and setting a new 3DMark GPU world record with GIGABYTE Super Overclock Edition.

GIGABYTE creates a secret weapon, HD 5870 Super Overclock Edition, is built using ATI RadeonTM HD 5870 GPU which is based on 40nm process and advanced GDDR5 memory technology. The powerful new GPU provides for a host of innovative new features including Microsoft DirectX® 11, ATI Eyefinity Technology, and offer an incredibly immersive HD gaming experience and unrivaled performance.

ATI Eyefinity Multi-display Technology

Benefiting from ATI Eyefinity Technology, every gamer can run up to 3 displays from a single HD 5870 graphics board and expand the field of view across all displays. End-users can enjoy the ultimate gaming experience with innovative “wrap around” multi-display capabilities with ATI Eyefinity Technology.

GIGABYTE HD 5870 Super Overclock Edition presents exquisite industrial design, including GIGABYTE self-feature fansink, extremely user-friendly, amazing speed and digital tweaking. Those unique features help hard-cord gamers easy to overclock. Only serious gamers deserve such premium graphics cards.

Anti-turbulence Inclined Dual Fan

The outstanding dual fan design doubles the cooling capability and offers extreme silent environment. GIGABYTE builds up an inclined cooling fan which helps heats can spread effectively from hot areas. 4 heat-pipes contribute to 13?cooler than reference fansink.

Extremely User-friendly

GIGABYTE specific voltage read point provides hard-core gamers an ultimate benching experience at overclocking competition. Heavy users can change the voltage simply by software instead of modifying any components on PCB. Overclockers are easy to master the platform and monitor GPU workload in time just through voltage read point.

 

Amazing Speed

GIGABYTE NEC Prodilizer® also known as film capacitor unique features excellent noise absorption performance at GHz frequency, extreme low ESL/ ESR, high current capability, and high switching frequency. The Prodilizer® provides pure electric current and transmits more stable power even on heavy loading.

Digital Tweaking

GIGABYTE adjustable software offers gamers to adjust all contents, including Core/ Shader/ Memory tuner, GPU/ Memory Voltage tuner, PWM tuner and Fan Speed tuner. User-friendly software gives hard-core gamers liberty on overcloking.

The GIGABYTE Super Overclock Series contains GTX 260, HD 5870 and upcoming HD 5770. For more details of the Super Overclock Series, please visit the GIGABYTE VGA website at: http://www.gigabyte.com.tw/Products/VGA/Default.aspx

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[CeBIT 2010] MSI to showcase Wind U160 and X-Slim X620 at CeBIT 2010

Posted on 22 February 2010 by bluetooth

MSI Notebooks—The Top Choice for Your Audio-Video Needs
Coming soon to CeBIT 2010

MSI will be presenting its outstanding array of products at CeBIT 2010, the world’s largest computer exhibition in booth area C38 in hall 17 from 2 to 6 March. In addition to showing the Wind U160 and X-Slim X620, both winners of the Germany’s iF Product Design Award for 2010, MSI will be displaying the GT660, a gaming notebook with superior multimedia capabilities designed in collaboration with one of the world’s leading stereo manufacturers.

Insisting on the best
The notebook market continued to grow in 2009 despite the economic gloom that enshrouded the globe. According to a survey of world markets, 127 million conventional laptops were sold in 2009, representing a 4.5% increase over 2008. Furthermore, 33.26 million netbooks were sold in 2009 compared to 15. 09 million in 2008. That’s an increase of 120%. With 2010 looking bright, MSI, backed by 23 years of technology and design, is scheduled to display its products at CeBIT 2010—the world’s largest international computer show in Hanover, Germany.

MSI President Joseph Hsu explains that despite last year’s financial tempest, MSI Notebooks still handed in a report card showing continued growth. In light of the this year’s economic recovery, MSI is determined to continue to “insist on the best” as it develops leading new high tech products that better meet the needs of consumers to make MSI one of the top ten laptop manufacturers in 2010.
Leading the way with five top technologies
Hsu stressed that after introducing Wind, the world’s first 10” netbook in 2008, MSI unveiled the world’s first ultra-thin X-Slim Series notebook with CULV in 2009. MSI’s new items for 2010 are simply amazing and include the Wind U160, the world’s first ultra-slim netbook with 15 hours of battery power, the slender X-Slim X620 with CULV’s superior multimedia capabilities, the GT660, an earthshaking gaming notebook equipped with Intel’s most advanced Core i7 Quad Processor, and the dual-screen multi-touch e-reader which attracted so much attention at CES.

MSI Marketing Director Sam Chern added that MSI’s theme will be “superior performance and multimedia capabilities” at CeBIT, symbolizing five major trend-triggering technologies in which MSI holds a leading position. These include MSI’s exclusive TDE overclocking and cooling technology, the smart GPU Boost power management technology, Cinema Pro high resolution image technology, advanced stereo technology, as well as award-winning designs for notebooks that are attractive, fashionable, slim, and light. These five major technologies are important to MSI as it develops beautiful laptops, environmentally friendly batteries with extended life, superior multimedia capabilities, and excellent display effects.

Chern goes on to explain that with these five major technological leads, this year, MSI is unveiling a number of notebooks with sizes from 10” to 17”. MSI will be showing close to 30 new models at the show, including the gorgeous 10” Wind U netbook with extended battery life, notebooks with professional multimedia capabilities from the ultra-thin X-Slim Series, G Series gaming computers with Intel’s new high performance core processor, classic and chic computers from the C Series which offer the best performance to price ratio, and new high end models from the P and F Series designed with the business and fashion markets.
Great sound and visuals
Chern explains that during CeBIT this year, MSI will be showing the ultimate in sight and sound. To this end, MSI worked in collaboration with one of the world’s top names in sound systems to develop the GT660, a gaming laptop that will make its debut during the show. The GT660 is the only notebook in the world with LED light display technology, so whether you are listening to music, watching a film, or engrossed in a video game, the LED light display technology will be there to help maximize your audio and visual experience.

Chern points out that in addition to MSI’s strong array of notebooks, a number of conceptual products with leading technologies will be displayed at the exhibition, including the large screen 3D GE700 notebook, MSI’s multi-touch control dual screen slate and the multi-touch control single screen e-reader. For more on the latest information about MSI at the 2010 CeBIT computer show, please go to http://www.msi.com.
Information about MSI’s booth at CeBIT 2010, Hanover, Germany
Time: March 2-6, 2010
Location: Hall 17, Booth C38

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Samsung demonstrates N150, the first LTE netbook at Mobile World Congress

Posted on 17 February 2010 by bluetooth

February 16th, 2010, Barcelona, Spain – Samsung Electronics Co. Ltd., a leading provider of future mobile and IT
technology, is demonstrating the world’s first Long Term Evolution (LTE) netbook PC at Mobile World Congress 2010.
Samsung’s own in-house designed LTE modem chipset, Kalmia, enabled the development of a small form factor
netbook with LTE capability. Following the company’s latest deployment of a commercial LTE dongle, Samsung
reasserts its industry-leading position in next generation mobile technology with the largest line-up of devices.
Samsung demonstrates live video streaming via the company’s own LTE network equipment on the Samsung
netbook N150.The Samsung netbook N150 is currently available in market with HSPA 3G communications and WiFi
access and will become commercially available with LTE according to service schedule and market demand. The
inclusion of LTE will deliver high speed, low latency and ubiquitous connectivity to all users who require high-volume
data access whenever they want and wherever they are. For the first time, operators preparing for the deployment of
next generation networks can deliver high-powered products to showcase network strength and the true benefits to
end-users.
With its high-quality design and great value, the Samsung N150 offers users everything they need in a portable
netbook. The N150’s 10.1” anti-reflective LED display gives users fine-tuned images with the sharpest detail and
boldest colours, without the inconvenience of mirror effects under bright lights or in sunny weather. This energy-
efficient display also works with the N150’s optimized processing performance and Samsung’s proprietary-enhanced
battery life solution to deliver exceptional battery performance of up to 8.5 hours*.
Using the integrated Easy Resolution Manager tool, screen resolution can easily be changed if a program or game
needs to be viewed in 1024×768. Additional visual enhancements include an integrated Digital LiveCam for video-
conferencing or live messaging. An integrated webcam, internal microphone and headphone-out connection
also provide an easy and cost-effective way to stay in touch with friends and family using video-conferencing, live
messaging or VoIP telephony.
“The N150 is the smart choice to meet all your essential mobile computing needs with style,” said Kyu Uhm, Vice
President of Samsung IT Solutions Business.
He continued, “We see increasing demand for data services, regardless of whether the consumer is indoors, outside,
or even on the move. With our end-to-end Total Solution from core chipset to a variety of devices, we are providing
true value to our customers.”
Samsung has proven its leadership in next generation mobile technology and has a long history of involvement in the
3rd Generation Partnership Project (3GPP). Collaboration with groups of telecommunications associations to make a
globally applicable 3G and 4G standard is a natural progression for Samsung, who are also introducing the most up-
to-date LTE technology at the show.
Samsung’s public demonstration of Long Term Evolution (LTE) included a total solution from infrastructure to mobile
devices. In particular, Samsung has developed its own access and core networks, which support multi-vendor
interoperability. Besides the world’s first LTE embedded netbook PC, Samsung is also showcasing the dongle
type device GT-B3710. Samsung’s LTE solution is fully compliant with the latest 3GPP LTE Rel-8 standard. Initial
deployment of the service began in 2009 and active discussion and trial tests will continue in 2010.
Alongside the world’s first demonstration of the LTE netbook N150, Samsung also showcased an extensive line-up of
netbook and note PCs at the show including N210, N220 and NB30.
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