Taiwanese chip designer MediaTek plans to tape out its first 2-nanometer chip at TSMC in September 2025, according to CEO Rick Tsai, who made the announcement at the Computex 2025 forum in Taipei. This marks a significant milestone in MediaTek’s technological roadmap, signaling its intent to remain at the forefront of advanced semiconductor development. Taping out a chip refers to the final stage of design before manufacturing begins, and moving to the 2nm node represents a major leap in performance and energy efficiency compared to current 3nm and 5nm technologies.
The project will rely on the cutting-edge capabilities of TSMC, the world’s largest and most advanced semiconductor foundry, which is also based in Taiwan. MediaTek’s collaboration with TSMC highlights the strength of Taiwan’s semiconductor ecosystem and its central role in the global chip supply chain. As competition intensifies in high-performance computing and mobile applications, the move to 2nm technology will help MediaTek better position itself against major rivals such as Qualcomm and Apple.
![[Press Image]OPPO Reno13 Series to Debut with MediaTek Dimensity 8350](https://en.ocworkbench.com/wp-content/uploads/2024/12/Press-ImageOPPO-Reno13-Series-to-Debut-with-MediaTek-Dimensity-8350-150x150.jpg "OPPO Partners with MediaTek to Launch the Reno13 Series Featuring the Dimensity 8350")