GIGABYTE Releases H370 And B360 AORUS GAMING WIFI Series Motherboards
Introducing Next Generation WIFI Ready Motherboards
Taipei, Taiwan, April 3rd, 2018 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, is pleased to announce the release of the newest H370 AORUS GAMING 3 WIFI and B360 AORUS GAMING 3 WIFI motherboards. The motherboards boast Intel® CNViTM WIFI technology through the Intel® Wireless-AC 9560 module for optimized wireless connectivity and a Realtek ALC1220-VB audio CODEC for crisper audio quality. Featuring critically-acclaimed Ultra Durable technology, H370 and B360 AORUS GAMING 3 WIFI motherboards are designed with a high-quality power design and are CEC 2019 compliant for the most stable, durable, as well as energy efficient motherboards.
H370 and B360 AORUS GAMING 3 WIFI motherboards implement an Intel® Wireless-AC 9560 module with Intel® CNViTM WIFI technology to support 802.11ac wireless features and BLUETOOTH 5. When paired with Intel® 8th Gen. Core processors, the motherboards deliver next-gen wireless connectivity that is significantly faster and more stable at further range. Under the AORUS design, the 2×2 802.11ac WIFI Wave 2 is optimized for faster download speeds even under dense network traffic as well as delivery speeds up to 1.733 Gbps when using 160 MHz channels, doubling that of standard designs. Simultaneous support for multiple devices is enabled on these boards by their 2T2R Antenna design, resulting in a maximum transmission bandwidth 2x higher than that of previous generations. In addition, the boards offer lightning-quick Ethernet from its Intel GbE LAN with cFos accelerator and WTFast. The inclusion of a GIGABYTE exclusive gaming LAN RTL8118 Ethernet controller gives the gamer advanced control over net traffic priority, ensuring that gamers are never a step behind their opponents.
Supporting the Intel® 8th Gen. Core processors, the H370 and B360 AORUS GAMING 3 WIFI motherboards deliver impressive performance that gamers associate with the AORUS brand. The boards’ 4 DIMMs Dual Channel DDR4 configuration is compatible with memory modules up to 2666MHz. The H370 AORUS GAMING 3 WIFI motherboard utilizes a Hybrid 8+2 Phase PWM design with a superior transistor to maximize efficacy of its power delivery while reducing the thermal constraints of traditional designs. It provides excellent support for Intel® Core™ i7 8700K processors and with its refined PWM design, ensures that sufficient power is supplied to the power-hungry components while keeping the areas around the CPU less vulnerable to thermal exposure. The motherboards are also meticulously designed with highly power-efficient components so that power consumption is compliant with standards set by the CEC 2019 Energy consumption regulations. A BIOS option is available for activating the power-saving mode in which the motherboards conserve up to 15% less power relative to older platforms.
Onboard audio quality is also significantly bolstered by the upgrade to a Realtek ALC1220-VB audio CODEC on these H370 AORUS GAMING 3 WIFI boards. The improvement is particularly noticeable for the front panel MIC with SNR values increased by almost 20% to 110 dB(A), enhancing the audio aspect of the streaming experience. Gamers will be able to take full advantage of the audio quality by making use of the improved auditory cues to locate enemies more effectively and utilize team voice chat for clearer communication in game. Impedance-detecting Smart Headphone AMP prevents distortion and low volume issues.
The redesigned M.2 Heatsinks on these H370 and B360 AORUS GAMING 3 WIFI motherboards take storage performance to the next level with a dual M.2 design. One of the slots is protected by a M.2 Thermal Guard limiting the effect of thermal throttling and allowing for transfer speeds up to 32 Gbps. Furthermore, the SATA/PCIe dual mode M.2 slot designed by GIGABYTE and support for Intel® OPTANE™ Memory Technology offers plenty of flexibility by allowing the user to install dual M.2 SSDs to enjoy upgraded storage performance. The Intel®native USB 3.1 Gen 2 design on these boards enables transfer speed up to 10Gbps.
Smart Fan 5 is a highly effective cooling solution for H370 and B360 AORUS GAMING 3 WIFI motherboards and allows users to keep heat sensitive areas on the motherboard cool. Hybrid fan headers and thermal sensors can be put to full use so users can be assured that their PCs don’t overheat when running performance heavy tasks. RGB Fusion Technology adds style to these boards, and offers onboard LEDs as well as support for 5V or 12V Lighting strips which can be customized by users to their liking. With more than ten different preset configurations for RGB Fusion, users can build their ideal machines while bringing extra style to their workspace configurations.
GIGABYTE H370, B360 and H310 motherboards are made with critically-acclaimed Ultra Durable components such as all solid capacitors, anti-sulfur resistors for limiting sulfur or acid corrosion, and DualBIOS Technology for preventing unnecessary hardware maintenance. Other GIGABYTE H370, B360 and H310 AORUS and Ultra Durable series motherboards will soon be available after the launch of the H370 and B360 AORUS GAMING 3 WIFI motherboards. For additional product information and news on these motherboards, please visit http://www.gigabyte.tw/products/main.aspx?s=42