MediaTek has officially unveiled its next-generation flagship chipset, the Dimensity 9500, this afternoon.
Built on TSMC’s third-generation 3nm process, the Dimensity 9500 will debut inside the upcoming vivo X300 series, which is slated to launch in Shanghai on October 13, with sales in Taiwan starting as early as November.

The new chip delivers a 32% boost in single-core performance and a 17% lift in multi-core performance compared to its predecessor. Its redesigned large cores achieve the same level of performance while cutting power consumption by 55%, making it significantly more energy-efficient in daily use.

This generation also introduces the Imagiq 1190 image processor, the Dimensity RAW engine, and a powerful new NPU, enabling the chip to process 200MP photos natively, capture cinematic 4K 60fps video, and lock focus with greater speed and accuracy.

vivo confirmed that the X300 series will harness the Dimensity 9500 alongside its latest NPU 990, unlocking advanced AI-driven experiences and photography effects. Detailed specifications remain under wraps until launch.