The GIGABYTE X79 OC-VRM allows you to overclock the CPU PWM in real-time. The GIGABYTE X79-UD7 is powered by a 16-phase power VRM via two 8-pin molex power connectors. Up to 1,500 Watts of power can be delivered to the CPU if needed for extreme overclocking and ultimate performance levels. The GIGABYTE X79-UD7 also features a unique POScap and PowerPAK MOSFET design that makes VRM insulation for extreme overclocking much easier than on traditional designs, while delivering faster power transfers and low temperatures. The GIGABYTE OC VRM is designed specifically for pursing the ultimate CPU performance, with low temperatures, great power stability and instant power feedback – ideal for breaking world records on Intel® Core™ i7 processors.
OC-Touch enables Overclockers to quickly and easily get the best performance from their system. Onboard OC-Touch buttons allow Overclockers to manually adjust the CPU ratio, BCLK settings as well as adjustments to the BCLK stepping ratio, to either 1MHz or 0.1MHz increments. These changes can be made in real-time, whether in BIOS, DOS, or Windows® without the need for rebooting, so that users can quickly fine-tune their system and find their CPU’s maximum frequency. A unique back-panel OC button allows novice Overclockers to automatically load a predetermined overclock configuration before continuing with OC-Touch to quickly find their CPU’s best margin. Onboard voltage measurement modules are also included to help users to conveniently monitor individual component voltages.
OC-PEG provides two onboard SATA power connectors that provide more stable PCIe power when using 3-way and 4-way graphics configurations. Each connector uses power from a different phase of the power supply, helping to provide a better, more stable graphics overclock. The independent power inputs for the PCIe slots helps to improve even single graphics card overclocking. For 4-way CrossFireX™, users must install OC-PEG to avoid over current in the 24pin ATX connector. The entire board also features POScaps, helping to simplify the insulation process so overclockers can quickly reach subzero readiness.