Intel IDF is round the corner. For the PC DIY users, most readers would be interested in the new Sandy Bridge, the next generation microarchitecture. Sandy Bridge is the next generation platform that will replace today’s Core i3, i5, i7 based on Lynnfield. As mentioned before, Sandy Bridge will comprise of new processors made on a 32nm process. It inherits that embedded GPU just like the current processors.

Unfortunately, it will require a new socket type LGA1155, so it wont be compatible to existing mainboards. We expect the new boards incorporating the new chipset to go on sale as early as Jan 2011 in line with the new processors.

We should also be hearing more about the PCI Express 3.0. With 128- and 130-bit encoding and data rates of 8 gigatransfers per second, it would benefit graphics cards that makes use of the extra bandwidth.

USB 3.0 and Light Peak will be another major turning point if Intel supports the USB 3.0. As we know, USB 3.0 is currently found on most boards with the NEC USB 3.0 chipset. If Intel were to support it, adoption would be way faster. So, will Intel make any announcement about USB 3.0 support, that remains to be seen.

In a pre-show event, Intel demonstrated their project at Intel Research Labs. The Object-Aware Situated Interactive System – or OASIS. The technology involves using a 3D camera, projector, and sophisticated software algorithms to create a touch-sensitive environment on everyday household surfaces.

The software can recognise and remember objects (3D). The software is smart enough to know when you’ve grabbed an object. Hold an apple and various recipes are projected on to the surface. Below is a video that demonstrates that.

Stay tuned for more.